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Flexible PCB(めっき) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
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Flexible PCB Product List

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Button-plated flexible printed circuit board (FPC)

Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.

Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.

  • button2.jpg
  • Printed Circuit Board
  • Circuit board design and manufacturing

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Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

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  • 20220629_1604550.5mmシャープペンの芯.jpg
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  • 20220629_1559340.5mmシャープペンの芯.jpg
  • 20220629_155818_0.5mmシャープペンの芯.jpg
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  • Wiring materials

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4-layer blind via flexible circuit board

Space-saving is possible! Suitable for high-resolution imaging diagnostic devices that require miniaturization.

The "4-layer blind via filled blind via flexible printed circuit board" is a multilayer FPC that enables high-density wiring while achieving miniaturization, lightweight, and thinness. It applies filled plating to blind vias, allowing for the creation of pads for component mounting on the vias. It possesses bending performance that rigid boards do not have. It is suitable for high-resolution imaging diagnostic devices, including endoscopes and catheters, where miniaturization is required. 【Features】 ■ Blind vias can be filled with plating on a 4-layer flexible board ■ Space-saving is possible as components can be mounted on top of the vias ■ It can be made lighter compared to rigid boards *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials

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Flexible Printed Circuit (FPC) "Long-Length FPC"

Achieving a length of 100m! Introducing a flexible circuit board that can handle long-distance wiring.

The "Long-Length FPC" is a flexible printed circuit board (FPC) that can accommodate lengths of up to 100 meters without seams or folds. In addition to being thin, light, soft, and able to take on various shapes, it achieves wiring lengths comparable to traditional cables. It can be used in large FA equipment and large lighting devices, and is also adopted for wiring in space development equipment such as satellites. 【Features】 ■ Can be used as an alternative to cables ■ Weighs about 1/100th compared to cables, making it lightweight ■ Thickness is approximately 0.1mm at most, allowing for installation in minimal spaces ■ Reduces the likelihood of miswiring compared to cables, improving work efficiency during assembly *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Stretchable flexible printed circuit board (FPC/flexible board)

It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC

While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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Double-sided flexible printed circuit board (double-sided FPC)

Double-sided type that allows for complex wiring.

This is an FPC with conductor patterns on both sides, allowing for complex wiring.

  • Printed Circuit Board

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Flexible circuit board

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide small quantities. They are used in a wide variety of electronic and precision devices, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided / Double-sided ■ Board thickness: Base thickness 25μm / 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Ultra-thin high-bend type flexible printed circuit board (FPC/flexible board)

We propose an extremely thin and highly flexible FPC.

It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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Flying lead flexible printed circuit board (FPC/flexible circuit board)

It is a flexible substrate that allows for a highly reliable connection.

By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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Blind Via (BVH) connection Flexible Printed Circuit (FPC)

It is a flexible substrate effective for high-density wiring. FPC

Unlike conventional through holes, to avoid penetrating the hole, a via is placed directly under the pad. Fine hole processing using lasers is possible, making it effective for ultra-high-density wiring, etc. With the miniaturization and thinning of mobile devices, as well as the enhancement of communication devices, there is an increasing demand for high-density mounting of narrow pitch, multi-pin packages. Consequently, flexible substrates are also advancing in terms of high-layer count and high density. FPC

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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Transparent Polyimide Flexible Substrate (FPC/Flexible Substrate)

It is a flexible substrate that combines heat resistance and transparency. FPC

Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.

  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Analysis

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